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Articles 8
- Design and technology solutions for developing one-time programmable memory pp. 67-71
- Dependence analysis of the GaN HEMT parameters on the thickness AlGaN barrier layer by numerical simulation pp. 37-39
- Real» insulating properties of an ultrathin silicon oxide pp. 3-10
- Real» insulating properties of an ultrathin silicon oxide pp. 58-65
- The production development of finish surface processing technology of SiC epi-ready wafers pp. 33-36
- The process of applying multi-layer insulation as object of control pp. 52-57
- The production development of finish surface processing technology of SiC epi-ready wafers pp. 24-26
- Influence of deep levels concentrations of semi-insulating substrate on high-voltage overloads of GaAs MESFETs pp. 99-102