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Journal Dynamics of Complex Systems - XXI century №1 for 2017 г.
Article in number:
Regression analysis in the research of the temperature stability of electronic circuits
Keywords: electronic device electronic parts temperature stability circuit simulator SPICE model factor experiment regression analysis equation of temperature inaccuracy
Authors:
D.V. Ozerkin - Ph. D. (Eng.), Associate Professor, Department of Radio Equipment Engineering and Manufacturing, Tomsk State University of Control Systems and Radioelectronics E-mail: ozerkin.denis@yandex.ru S.A. Rusanovsky - Ph. D. (Eng.), General Director, JSC «NPC «Polus» (Tomsk) E-mail: rusa10@yandex.ru
Abstract:
It is known that the temperature dependences of the parameters of the electronic devices are random in magnitude and sign within the limits of the set values. It is proposed to use the method of statistical planning of the experiment in combination with regression analysis for the mathematical description of the temperature inaccuracy of electronic devices. There is the possibility of obtaining both a linear equation and a nonlinear equation of the temperature inaccuracy of an electronic device in the form of a power series. It is accompanied by a statistically rigorous assessment of the adequacy of the polynomial obtained and the significance of the regression equation. The equation of temperature inaccuracy allows us to choose the method of thermal stabilization of an electronic device. In order to reduce labor intensity and economic costs in the implementation of the factorial experiment, we propose a perspective idea of substituting a physical factor experiment for a computational factor experiment. In this case, it becomes possible to use both widely known and original software products of circuit and topological design. The application of the circuit analysis module for finding the coefficients of the influence of the temperature inaccuracy equation is considered in detail.
Pages: 65-72
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