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A method of designing a hermetically sealed multichip microwave modules in LTCC technology and the research of their thermal condition

DOI 10.18127/j00338486-201910(15)-11

Keywords:

P.A. Tushnov – Main Technologist, PJSC «Radiofizika» (Moscow);  Lecturer, Department «Design of complex technical systems», Moscow aviation Institute (national research University)
E-mail: p.tushnov@gmail.com
A.V. Nevokshenov – Head of Department, PJSC «Radiofizika» (Moscow)
E-mail: nevokshenov.a@radiofizika.com, ahagar@yandex.ru
A.V. Kazakov – Deputy Head of Section, PJSC «Radiofizika» (Moscow)
A.V. Golubev – Technologist, PJSC «Radiofizika» (Moscow)


The development of design and technological methods for creating hermetic MCM cases for integrated functional devices of transceiver microwave paths of APAA X band RTM was carried out. The paper discusses examples of designs of multi-chip modules (MCM), made on the basis of technology of Low Temperature Co-Fired Ceramic (LTCC), implemented in PJSC «Radiofizika».
The value of the thermal conductivity coefficient of the multilayer ceramic wall and the value of the crystal-case thermal resistance for the examined cases are determined. An assessment of the applicability of the cases for various intervals of the values of power removed to the heat is given. The experiments carried out in the process of technological preparation of serial production of the batch of X band RTM confirmed the results of numerical simulation. Numerical simulation and performed experiments allow us to establish the permissi-ble limits of power dissipated into heat.

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May 29, 2020

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