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Modern design tool and a comprehensive analysis of the structures of electronic modules of the third level

Keywords:

P.V. Ievlev – Post-graduate Student, Department of Radio Equipment Engineering and Manufacturing, Voronezh State Technical University
E-mail: ievlev92@mail.ru
A.V. Muratov – Dr. Sc. (Eng.), Professor, Head of Department of Radio Equipment Engineering and Manufacturing, Voronezh State Technical University
E-mail: kipr@vorstu.ru
T.L. Turaeva – Ph. D. (Phys.-Math.), Head of Department of Physics, Voronezh State Technical University
E-mail: tlturaeva@mail.ru
A.V. Turetsky – Ph. D. (Eng.), Associate Professor, Department of Radio Equipment Engineering and Manufacturing, Voronezh State Technical University
E-mail: tav7@mail.ru


Modern production is based on the paradigm of electronic design, significantly reducing development cost and speed up the process of creating a quality product. Using the procedure of computer simulation allows to choose the best design solution to replace a large number of tests of the actual products by testing their VIR-toiling prototypes. Today the actual problem is the development of electronic systems, the functional dominant in terms of mutual influence of various physical processes. This requires the use of multidisciplinary design environment, within which you can create, analyze and optimize electronic systems in the same context as the electric cal, mechanical, and other elements.
Formulated the basic criteria that must be met by a software package for its successful use in the electronic industry: 1) the multidis-ciplinary modeling of electronic products industry, which functioning is based on the interaction of various physical processes; 2) suf-ficient performance when working with large assemblies, since the electronic product is a complex hierarchical system; 3) the presence of specialized modules and experience of application in electronic and instrument-building industries; 4) the possibility of interfacing with other software systems along with the availability of own means of modeling the geometry of the product; 5) price factor; 6) the visibility of the interface.
A comparative analysis of the capabilities, advantages and disadvantages of CAE tools, and examples in the world practice their use in the process of creating radioelectron moduli of the third level. Selected the three most promising in the field of electronics and software product that a universal opportunities have specialised modules focused on application in electronic and instrument-making from the sectors: ANSYS, MSC.NASTRAN and CREO.

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June 24, 2020
May 29, 2020

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