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Simulation of three-dimensional thermal fields in integrated circuits assembly


A.V. Achkasov – Ph.D. (Eng.), Research Institute of Electronic Engineering. E-mail:
V.F. Barabanov – D.Sc. (Eng.), Professor, Voronezh State Technical University. E-mail:
M.N. Aralov – Research Institute of Electronic Engineering E-mail: S.L. Podvalniy – Dr. Sc. (Eng.), Professor, Voronezh State Technical University. E-mail:

The article «Methods and algorithms for simulation of thermal field sin the three-dimension alassembly of integrated circuits» covers the thermal problems that arisedue to increasedpacking density and power density integrated circuits. Currently, the technology of three-dimensional assembly of integrated circuits or 3D assembly is one of the most promising methods to reduce chip sizes by increasing the packing density, increase connection capacity and reduce energy. However, increasing the packing density and specific heat capacity causes problems that become a critical factor in deter mining the performance, reliability and cost of the chip. These problems include the appearance of local over heating zones, the need for rational design of temperature sensors, electromigration calculation, etc. We need an effective thermal analysis in the design phase of a new product. Most previously known universal methods of the thermal parameters calculation do not provide acceptable accuracy or difficult to software implementation, which makes them unsuitable for implementation indesign systems. This article provides an overview of various mathematical methods developed for the thermal analysis of electronic components. To calculate the temperature characteristics authors encouraged to use approaches based on the Green's function, the discontinuous Galerkin method, cosine transform, etc. numerical methods. All described algorithms are realizable in software and can be used to create special design tools of digital technology. The article presents the necessary mathematical calculations, illustrations are definitions. Key matters are backed by references to the literature. The material can help the designer to select the most appropriate method for calculating the thermal parameters for a particular purpose. Given the urgency of the problem, the article may generate interest among electronics manufacturers and designers of special software.

  1. Achkasov A.V., Barabanov V.F., Pashkovskiy M.E. Hardness simulation and evaluation for electronic products in the space: Monograph / ed. by S.L. Podvalniy. Yelm. WA. USA: Science Book Publishing House. 2013. 172 p.
  2. Barabanov V.F., Aralov M.N. Struktura programmnoj modeli czifrovogo ustrojstva - Informaczionny'e texnologii modelirovaniya i upravleniya (ITMU): Nauchno-texnicheskij zhurnal, № 6 (84),  s. 583-589.
  3. Barabanov V.F., Aralov M.N., Grebennikova N.I. Matematicheskie metody' modelirovaniya teplovy'x polej v trexmernoj sborke mikrosxem // Vestnik VTTU. 2013. T. 9. № 6-3. S. 55-57.
  6. Achkasov A.V., Smerek V.A. Proektirovanie matematicheskogo i programmnogo obespecheniya otkazoustojchivy'x slozhny'x funkczional'ny'x blokov mikroe'lektroniki speczial'nogo naznacheniya / pod red. S.L. Podval'nogo. Voronezh: Izdatel'stvo «Nauchnaya kniga». 2014. 160 s.
  7. Bragin D.M., Barabanov V.F., Nuzhny'j A.M. Integrirovanny'j programmny'j kompleks modelirovaniya i proektirovaniya e'lektronny'x sredstv s uchetom teplovy'x polej // Sistemy' upravleniya i informaczionny'e texnologii. 2007. № 3 (29). S.63-66.
  8. Barabanov V.F., Podval'ny'j S.L. Interaktivny'e sredstva modelirovaniya slozhny'x texnologicheskix proczessov. Voronezh: VGTU. 2000. 124 s.

May 29, 2020

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