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The optimization of the mechanical surface processing technology of SiC wafers

Keywords:

V. V. Popov – Ph.D. (Eng.), General Director, JSC «Svetlana», St.-Peterburg
V. N. Vyuginov – Ph.D. (Eng.), Director, CJSC «Svetlana-Semiconductors», St.-Peterburg. E-mail: mail@svetlana-ep.ru
N. K. Travin – Leading Engineer, CJSC «Svetlana-Semiconductors», St.-Peterburg. E-mail: travin@svetlana-ep.ru


The analysis of the market was performed, and the equipment for double side lapping and polishing of 3-inch semi-insulating 6H-SiC wafers was selected. To optimize the double side lapping, the following parameters were determined: the rotation speed and the upper plate pressure. Besides, we have replaced the single component slurry on the basis of boron carbide, recommended by the manufacturer of the equipment, with the multi-component slurry. It helped to reduce the lapping time, as well as to improve the quality of the lapping surface. During the double side polishing process optimization, the surface roughness Ra less than 2 nanometers was obtained.
References:

  1. Lebedev A. A., Belov S. V., Lebedev S. P., Litvin D. P., Nikitina I. P., Vasil'ev A. V., Makarov Yu. N., Nagalyuk S. S., Smirnov A. N., Popov V. V., V'yuginov V. N., Shifman R. G., Kuzmichyev Yu. S., Travin N. K., Venediktov O. V. Poluizoliruyushchie 6H-SiC podlozhki dlya primeneniya v sovremennoy elektronike // Elektromagnitnye volny i elektronnye sistemy. 2014. № 4.
  2. Popov V. V., V'yuginov V. N., Travin N. K. Rezul'taty razrabotki tekhnologii rezki monokristallov karbida kremniya // Elektromagnitnye volny i elektronnye sistemy. 2014. № 4.
  3. http://www.lapmaster.co.uk
  4. http://www.logitech.co.uk
  5. http://www.speedfam.com/en/index.html
  6. http://www.peter-wolters.com/

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